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Characteristic Impedance must be controlled on many layers, having different dielectric materials and trace width requirements, necessitating separate thickness calculations.
Layer-to-layer signal transport without degradation of Characteristic Impedance continuity.
Special traces to transform impedance level.
Provide for post-fabrication adjustments to compensate for tolerance variations of the board material.
Design and lay out special circuitry around the DUT to permit use of lower frequency lower cost/hour IC testers |
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