|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Special techniques to orient, space, and connect components to minimize signal loss and unwanted feedback, coupling, and parasitic inductance.
Correct dielectric material selection for lowest cost but acceptable signal loss.
Various power and ground planes must be specially planned to provide adequate shielding.
Selection of special connectors and other components.
Special power decoupling techniques must be implemented. |
|
|
|